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Mark D. Poliks, Ph.D. 607-755-2064 (office) |
Education |
Recent Publications: (32 publications) “Controlled Degradation of Epoxy Networks: Analysis of Crosslink Density and Glass Transition Temperature Changes in Thermally Reworkable Thermosets,” J. S. Chen, C. K. Ober, M. D. Poliks, Y. Zhang, U. Wiesner and C. Cohen, Polymer, 2004 , 45, 1939-1950. “Study of the Interlayer Expansion Mechanism and Thermal-Mechanical Properties of Surface- Initiated Epoxy Nanocomposites,” J. S. Chen, C. K. Ober, M. D. Poliks, Y. Zhang, U. Wiesner, and E. Giannelis, Polymer, 2002 , 43(18) , 4895-4904. “Characterization of Thermally Reworkable Thermosets: Materials for Environmentally Friendly Processing and Reuse,” J. S. Chen, C. K. Ober and M. D. Poliks, Polymer, 2002 , 43(1), 131-139. “Development of Conductive Adhesive Materials for Via Fill Applications.” S. Buchwalter, N. LaBianca, J. Gelorme, S. Purushothaman, K. Papathomas and M. D. Poliks, Proceedings - 50th Electronic Components and Technology Conference , 2000 , 887-891 and IEEE Transactions on Components and Packaging Technology , 2001 , 24(3), 431-435. |